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Taconic manufactures microwave laminates with uniform thickness profiles, precise dielectric constants, and consistently low dissipation factors throughout the entire panel. The exceptionally low loss factors extend the usefulness of these Taconic laminates to X-Band and above. Taconic RF laminates can be sheared, drilled, milled, plated and routed, using the accepted methods for PTFE/woven fiberglass laminates. Taconic laminates are dimensionally stable and are resistant to the process solution used during fabrication. |
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Ceramic filled PTFE laminates combines the benefits of woven glass reinforced fluoropolymer chemistry with the thermal, mechanical and electrical enhancements of ceramic elements. These organic-ceramic laminates are the best value for the low cost, high performance demands of microwave and radio frequency antenna applications. |
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| NF-30 | 3.00 ± 0.04 | 0.0013 | Download | Download | Download | Ceramic Filled PTFE Composite |
| NF-30-A | 3.00 ± 0.04 | 0.0013 | Download | Download | Download | Ceramic-filled PTFE composites without a woven fiberglass reinforcement |
| RF-35TC | 3.5 ± 0.05 | 0.0011 | Download | Download | Download | High TC, DK 3.5 base material |
| RF-35TC-A | 3.5 ± 0.05 | 0.0017 | Download | Download | Download | Thermally effective low loss laminate |
| RF-35HTC | 3.5 ± 0.05 | 0.0007 | Download | Download | Download | High thermal conductivity laminate |
| RF-35A2 | 3.5 ± 0.05 | 0.0011 | Download | Download | Download | Lowest loss 3.5 DK base material |
| RF-35 | 3.5 ± 0.1 | 0.0018 | Download | Download | Download | Historical volume DK 3.5 product |
| RF-301 | 2.97 ± 0.07 | 0.0012 | Download | Download | Download | High Volume antenna material |
| RF-30A | 2.97 ± 0.05 | 0.0013 | Download | Download | Download | Stable Performance antenna material |
| RF-30 | 3.0 ± 0.1 | 0.0014 | Download | Download | Download | High Volume antenna material |
| RF-30-7H | 2.97 ± 0.07 | 0.0012 | Download | - | - | High Volume antenna material |
| RF-10 | 10.2 ± 0.3 | 0.0025 | Download | Download | Download | Low Loss High DK Material |
| RF-60TC | 6.15 ± 0.15 | 0.0020 | Download | Download | Download | High TC, High DK Material |
| TRF-41/43/45 | 4.1,4.3,4.5 ± 0.15 | 0.0035 | Download | Download | Download | Low cost RF laminate with FR4 DK values |
| EZ-IO-F | 2.80, 2.85 | 0.0015, 0.0014 | Download | Download | Download | Thermally stable composite based on nanotechnology, spread weave and PTFE |
| TLF-35A | 3.5 ± 0.05 | 0.0022 | Download | Download | Download | Advanced TLF - Improved PTH and PIMD Performance |
| TLF-34/35 | 3.4, 3.5 ± 0.07 | 0.002 | Download | - | - | Low cost DK 3-4 - 3.5 base material |
Hydrocarbon Laminates and Prepreg are thermosetting dielectric layers based on polybutadiene.
| Products | DK | Loss Factor (2GHz) |
Loss Factor (10GHz) |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| HF-300F | 3.00 | 0.0022 | 0.0029 | Download | Download | Download | Flame retarded Hydrocarbon laminate for microstrip/stripline antenna |
| HF-330 | 3.35 | 0.0019 | 0.0025 | Download | Download | Download | Hydrocarbon laminate for microstrip/stripline antenna |
| HF-340 | 3.45 | 0.0019 | 0.0025 | Download | Download | Download | Hydrocarbon laminate for microstrip/stripline antenna |
| HF-341 | 3.45 | 0.0019 | 0.0025 | Download | - | Download | Hydrocarbon laminate for microstrip/stripline antenna |
| HF-350F | 3.50 | 0.0024 | 0.0029 | Download | Download | Download | Flame retarded Hydrocarbon laminate for power amplifiers |
| HF-350FTC | 3.55 | - | 0.0029 | Download | Download | Download | Flame retardant dielectric substrate for low loss and high thermal conductivity |
Woven glass laminates are constructed with a woven matrix of fiber-glass fabric coated with PTFE that is more mechanically stable and has a more uniform dielectric constant than traditional non-woven products. The laminates are dimensionally stable, and exhibit virtually no moisture absorption during fabrication process.
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| TLA | 2.62 ± 0.05 | 0.0012 | Download | Download | Download | Low cost antenna laminate |
| TLC | 2.75, 3.0, 3.2 ± 0.05 |
0.0022 | Download | Download | Download | Legacy low cost RF laminate |
| 0.0028 | ||||||
| 0.003 | ||||||
| TLE | 2.95 ± 0.05 | 0.0026 | Download | Download | Download | Thin dielectric base material for couplers |
| TLP | 2.2, 2.33 ± 0.03 |
0.0009 | Download | Download | - | Low cost volume material |
| TLT | 2.45 - 2.65 ± 0.04 |
0.0006 | Download | Download | Download | Legacy low DK base material |
| TLX | 2.45 - 2.65 ± 0.04 |
0.0015 - 0.0021 | Download | Download | Download | Low DK base material |
| TLX-8 | 2.55 | 0.0017 | Download | Download | Download | Low DK base material |
| TLY | 2.17 - 2.20 ± 0.02 |
0.0009 | Download | Download | Download | Military grade very low DK base material |
| TLY-5 | 2.20 | 0.0009 | Download | Download | Download | Avionics & aerospace grade very low DK base material |
| TLY-5Z | 2.20 ± 0.04 | 0.0010 | Download | Download | Download | Low DK/Low Z Axis Expansion/Low Density Laminates |
TSM family of materials provides a solution to the difficulty of manufacturing high layer count multilayer PCBs with PTFE cores. The low fiberglass content of the TSM family allows more predictable multilayer manufacturing vs. non-woven materials.
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| TSM-DS3 | 3.0 ± 0.05 | 0.0011 | Download | Download | Download | Dimensionally stable, low loss laminate, rivals epoxy |
| TSM-DS3M | 2.94 ± 0.04 | 0.0011 | Download | Download | Download | Dimensionally stable, low loss laminate, rivals epoxy |
| TSM-DS3b | 3.0 ± 0.04 | 0.0011 | Download | Download | Download | Dimensionally stable, low loss laminate, rivals epoxy |
Closely controlled melt point and resin flow provides a predictable laminating cycle. It enables low cost, electrically stable PCB fabrication.
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| fastRise™ 25, 26, 27, 28 (FR-27-0045-35) |
2.72 ± 0.04 | 0.0014 | Download | Download | Download | Lowest loss non-reinforced prepreg |
| fastRise™7 | 7.45 | 0.0030 | Download | Download | Download | High DK, low loss glass-reinforced prepreg |
| fastRise™EZ pure |
2.8 | 0.0032 | Download | Download | Download | Low temperature curing, thermosetting prepreg |
| TacBond 1.5 | 2.35 | 0.0025 | Download | Download | - | Thermoplastic bonding film |
| HB-series | 3.02-3.67 | 0.0027-0.0029 | Download | Download | - | RF/multilayer components |
Taconic is providing various types of specialty materials such as heavy metal backed copper clad laminates, and high thermal conductivity LED lighting substrates, etc.
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| TacLamPLUS | 2.1 ± 0.02 | 0.0009 | Download | - | - | Ultra-thin base materials for mmWave applications |
| Heavy Metal Backed Base Materials |
2.1 - 10 | - | - | - | - | For power amplifier and radio link pcbs |
| TLM (unclad) | - | - | Download | Download | - | Unclad Materials for gaskets, etc. |
| TCM-0015/21-F | 2.55 | 0.0025 | Download | - | - | Cover Material for Phase Shifter |
| TCM-0020/26-F | 2.4 | 0.0025 | Download | - | - | |
| TLC Specialty Products |
3.38 3.5 |
0.0034 0.0037 |
Download | Download | Download | low cost specialty RF laminate |
| TLC-32 | 3.00 ± 0.05 | 0.0030 | Download | Download | Download | Low Cost RF Substrate |
| Product Selection Guide.pdf File Download |  |
